The bricking process – 10% increased productivity with the BrickMaster.

The objective in wafering is greater than 98% yield, greater than 95% uptime at lowest production costs. The newly-developed wire saw BrickMaster processes multi-crystalline silicon ingots into bricks with minimum kerf loss and maximum productivity. The BrickMaster is based on the market-proven wire sawtechnology of Meyer Burger – Swiss Slicing Systems.



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