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3S Photovoltaics is a leader in the field of building-integrated photovoltaics Solar Building Technologies. We develop and produce trend-setting, building-integrated solar systems and have specialised in solar modules for roofs, facades and shading solutions.
Pasan is the world reference for measurement equipment in the photovoltaic cell and module production, setting tomorrow’s standards. Pasan’s sun simulators ensure double the accuracy of the class standard and convince with exceptional light uniformity on the illuminated surface, outstanding spectral match and excellent light stability.
The CERTUS system from SOMONT is the right solution for cell and matrix connection. The modular concept integrates the necessary elements needed for the frontend production of solar modules and offers new state of the art stringer technology, In-line string testing, Matrix lay-up, Automation of matrix-interconnection processes, Matrix testing and transfer on the glass plate.
The 3S Modultec NG Series Laminating Line combines the patented 3S Hybrid Heating Plate and the TÜV-certified XL three-chamber-process. Both ensure shortest cycle times (down to 5.5 min/cycle) and highest quality of the solar module. Moreover 3S provides the newly developed 3S Membrane Red with an optimised material compound reducing the TCO drastically.
AMB’s Wet Wafer Separator WWS offers automatic and gentle separation of wet wafers, identification of double wafers, minimum breakage rate, high troughput and a continous material flow.
Hennecke Systems’ measuring and sorting devices are the standard quality control systems in the photovoltaic industry. Hennecke Systems has more than 10 years experience in the field of photovoltaic quality control. Leading wafer and cell manufacturers trust in the high quality products of Hennecke Systems.
DMT is the technology leader in diamond wire cutting - innovations and advancements in diamond wire production make our wire the ideal choice for cutting hard and/or brittle materials such as silicon, sapphire, crystals, and many other materials. Benefits include lower cost of ownership, increased process yield and increased uptime.
The DS 271 with a loading length of 1.000 mm (and the smaller version DS 264) are the best in industry guaranteeing an uptime of 95% at minimum and saw yield of more than 98%. Its production capacity is more than 3 million wafers/year signifying an output of up to 10 MW/year.
The bricking process – 10% increased productivity with the BrickMaster.
The objective in wafering is greater than 98% yield, greater than 95% uptime at lowest production costs. The newly-developed wire saw BrickMaster processes multi-crystalline silicon ingots into bricks with minimum kerf loss and maximum productivity. The BrickMaster is based on the market-proven wire sawtechnology of Meyer Burger – Swiss Slicing Systems.